Systems, methods, and apparatuses for hybrid memory

ABSTRACT

Embodiments of the invention are generally directed to systems, methods, and apparatuses for hybrid memory. In one embodiment, a hybrid memory may include a package substrate. The hybrid memory may also include a hybrid memory buffer chip attached to the first side of the package substrate. High speed input/output (HSIO) logic supporting a HSIO interface with a processor. The hybrid memory also includes packet processing logic to support a packet processing protocol on the HSIO interface. Additionally, the hybrid memory also has one or more memory tiles that are vertically stacked on the hybrid memory buffer.

RELATED APPLICATION

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 12/655,590, filed Dec. 31, 2009, entitled “SYSTEMS,METHODS, AND APPARATUSES FOR HYBRID MEMORY”, the entire contents ofwhich are hereby incorporated by reference.

TECHNICAL FIELD

Embodiments of the invention generally relate to the field of integratedcircuits and, more particularly, to systems, methods and apparatuses forhybrid memory.

BACKGROUND

Optimization of memory bandwidth, power efficiency and form factor arebecoming increasingly important as memory causes significant bottlenecksto future microprocessor systems. It is common for most CPU systems toutilize a dynamic random access memory (DRAM) based bulk memory solutionto provide capacity and bandwidth. However, DRAM process technology isprimarily optimized for capacity and cost to the sacrifice of bothbandwidth and power efficiency. On the other hand, logic processtechnology conventionally used for CPUs are optimized for logic density,power efficiency and bandwidth with the drawback being higher cost andlower memory density.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are illustrated by way of example, and notby way of limitation, in the figures of the accompanying drawings inwhich like reference numerals refer to similar elements.

FIG. 1 is a high-level block diagram illustrating selected aspects of acomputing system implementing at least one hybrid memory device.

FIG. 2 illustrates a more detailed view of an embodiment of a hybridmemory device.

FIG. 3A illustrates a side view of an embodiment of a strata-footprintfull hybrid memory buffer included in a hybrid memory package.

FIG. 3B illustrates a top view of an embodiment of a strata-footprintfull hybrid memory buffer included in a hybrid memory package.

FIG. 4A illustrates a side view of an embodiment of a small-footprintpartial hybrid memory buffer included in a hybrid memory package.

FIG. 4B illustrates an exploded side view of an embodiment of asmall-footprint partial hybrid memory buffer included in a hybrid memorypackage.

FIG. 4C illustrates a top view of an embodiment of a small-footprintpartial hybrid memory buffer included in a hybrid memory package.

FIG. 5 illustrates a side view of an alternative embodiment of a hybridmemory package.

FIG. 6 describes an embodiment of scan chain logic implemented in eachmemory stratum or memory tile to enable independent addressingdynamically during initialization.

FIG. 7 is a block diagram of an embodiment of a memory tile in a hybridmemory device.

FIG. 8 is a block diagram of an embodiment of the memory buffer in ahybrid memory device.

FIG. 9 illustrates an embodiment of a two-level memory system utilizinga hybrid stacked memory.

FIG. 10 is a flow diagram of an embodiment of a process utilizingadaptive power logic to optimize the power delivered to the hybridmemory device.

FIG. 11 is a flow diagram of an embodiment of a process utilizingadaptive refresh logic to optimize the power delivered to the hybridmemory device.

DETAILED DESCRIPTION

Embodiments are generally directed to systems, methods, and apparatusesfor implementing hybrid memory.

FIG. 1 is a high-level block diagram illustrating selected aspects of acomputing system implementing at least one hybrid memory device.

Computer system 100 is shown. The computer system may be a desktop,server, workstation, laptop, handheld, television set-top, media center,game console, integrated system (such as in a car), or other type ofcomputer system. In several embodiments the computer system 100 includesa system board 102 (i.e., motherboard) to couple several componentstogether. For example, the system board 102 may be capable of couplingcomponents through the use of wire traces and specific interfaces. Thesystem board 102 may deliver power to the coupled components.Additionally, the system board may provide a communicative interface toallow multiple components to communicate with each other.

Among the components coupled to system board 102 are one or more centralprocessing units (CPUs). Although in many embodiments there arepotentially many CPUs, in the embodiment shown in FIG. 1 only one CPU isshown for clarity, CPU 104. CPU 104 may be Intel® Corporation CPU or aCPU of another brand. CPU 104 includes one or more cores. In theembodiment shown, CPU 104 includes four cores: core A (106), core B(108), core C (110), and core D (112). In other embodiments, CPU 104 mayhave a number of cores either greater than or less than the four coresshown in FIG. 1. In many embodiments, each core (such as core A (106))includes internal functional blocks such as one or more execution units,retirement units, a set of general purpose and specific registers, etc.If the cores shown in FIG. 1 are multi-threaded or hyper-threaded, theneach hardware thread may be considered as a core as well.

CPU 104 may also include one or more caches, such as cache 114. In manyembodiments that are not shown, additional caches other than cache 114are implemented where multiple levels of cache exist between theexecution units in each core and memory. In different embodiments thecaches may be apportioned in different ways. Cache 114 may be one ofmany different sizes in different embodiments. For example, cache 114may be an 8 megabyte (MB) cache, a 16 MB cache, etc. Additionally, indifferent embodiments the cache may be a direct mapped cache, a fullyassociative cache, a multi-way set-associative cache, or a cache withanother type of mapping. Each cache may include one large portion sharedamong all cores in the respective CPU or may be divided into severalseparately functional slices (e.g., one slice for each core). Each cachemay also include one portion shared among all cores and several otherportions that are separate functional slices per core.

In many embodiments, CPU 104 is communicatively coupled to one or morehybrid memory devices, such as 116. Hybrid memory comprises a layout ofmultiple memory tiles stacked vertically and coupled to a substrate 118at least partially through a hybrid memory buffer 120 attached on thesubstrate. In many embodiments, the basic structure of a given memorytile may be that of a dynamic random access memory (DRAM).

The hybrid memory 116 device(s) are communicatively coupled to the CPU104 through a high speed (HS) input/output link 122 (i.e., interconnect,bus, etc.). The HS link 122 is communicatively coupled to the CPU 104through HS input/output (I/O) interface 124. In different embodiments,the CPU 104 and hybrid memory 116 may communicate through the use of aPCI-Express interface, a fully-buffered dual-inline-memory-module (DIMM)interface, a scalable memory interface (SMI), a proprietarypoint-to-point interface, such as the QuickPath technology by Intel®, oranother such high speed interface.

In many embodiments, the link 122 may include one or more optical wires,metal wires, or other wires (i.e. lines) that are capable oftransporting data, address, control, and/or clock information. In manyembodiments, the link is a high speed serial interface that includesmultiple lanes, each of which transport packetized data between the CPUand hybrid memory 116.

In many embodiments, CPU 104 includes a memory controller 126 totranslate information sent and received across the HS link 122. Thememory controller 126 is coupled to the HS I/O interface 124 to gainaccess to the link 122. In other embodiments that are not shown, memorycontroller 126 may be a discrete device directly coupled to the systemboard 102 or potentially integrated within another device (e.g., amemory controller hub) that is coupled to the system board 102.

Other devices generally present within computer system 100 are not shownfor sake of clarity. These devices may include one or more additionalCPUs, a high-performance hub complex that may allow the CPU 104 to becoupled to graphics and/or communication subsystems. Additionalcomponents may include one or more I/O complexes housing I/O adapters totranslate communications between the CPU and an I/O subsystem comprisingI/O devices (e.g., mass storage devices, Universal Serial Bus (USB)devices, etc. Some of the I/O devices may include direct memory access(DMA) capabilities to allow direct access to hybrid memory 116 from suchan I/O device through DMA transactions.

FIG. 2 illustrates a more detailed view of an embodiment of a hybridmemory device.

The hybrid memory device 200 structure may comprise many memory tiles,such as memory tile 202. Memory tile 202 includes at least one memoryarray (i.e. each array within a tile is made up of a grid of bit storagelocations, each location addressed through column and row decoders. Adetailed block diagram of a memory tile is illustrated in FIG. 7,described below.

Returning to FIG. 2, a grid of memory tiles makes up a single memorystrata 204. In FIG. 2, memory strata 204 is specifically indicated bythe thicker lines highlighting all the tiles at a single level above thehybrid memory buffer 206 (coupled to the memory substrate 208). Morespecifically, a memory strata can comprise a grid of any number ofmemory tiles in the X and Y direction in 3D space (a 3D space coordinatesystem reference is shown at the top of FIG. 2). For example, in theembodiment shown in FIG. 2, a memory strata, such as memory strata 204is 6 tiles in the X direction by 8 tiles in the Y direction for a totalof 48 tiles per strata.

In many embodiments, there are several memory strata stacked on top ofeach other. In FIG. 2 there are 8 total strata in the stack. The hybridmemory buffer 206, which is shown at the base of the stack, can compriseone of several forms. The form shown in FIG. 2 is a strata-footprintfull hybrid memory buffer that encompasses the same amount of X, Ydirection real estate as the memory stratas that are stacked on top ofit. In many other embodiments, the hybrid memory buffer comprises acompact size partial hybrid memory buffer that utilizes significantlyless space in the X, Y direction than the strata-footprint. The partialhybrid memory buffer is illustrated in FIGS. 4A-4C, which is describedbelow.

Regarding the strata-footprint full hybrid memory buffer 206 shown inFIG. 2, under each vertical column of tiles, such as highlighted columnX0, Y7 (shown with dashed lines), there resides a memory buffer (MB)tile, such as MB tile 212. A MB tile includes buffer functionalityutilized for the memory tiles in the specific column the MB tile isaligned with. In many embodiments, to access the entire memory tilecolumn (e.g. column 210), a set of through silicon vias (TSVs), such asTSV 214 are routed through each tile in each respective strata layer inthe column. FIG. 8 illustrates a detailed block diagram of hybrid memorybuffer functional blocks, this figure is described in detail furtherbelow.

In many different embodiments, the memory substrate 208 may be comprisedof one of many types of substrate layouts, though specific examplelayouts of substrates are not described to aid in the clarity of thediscussion.

FIG. 3A illustrates a side view of an embodiment of a strata-footprintfull hybrid memory buffer included in a hybrid memory package.

In some embodiments, the full hybrid memory buffer 300 is coupled to thepackage substrate 302 through S-to-S ECs 304. Additionally, in someembodiments, the S-to-S ECs 304 may comprise a ball grid array (BGA). Inother embodiments that are not shown, there may be another type ofcoupling mechanism utilized (e.g., a pin grid array (PGA)).

The memory strata are directly stacked on top of each other. In theembodiment shown in FIG. 3A, there are four memory strata in the stack:memory strata 306, 308, 310, and 312. In many embodiments, a bondingmaterial is utilized to bond each memory strata to the next memorystrata on the stack. The full hybrid memory buffer is coupled to each ofthe memory strata through the use of TSVs 314 and 316. TSVs 314 and 316have the capability to deliver power and information (i.e., individualTSVs may deliver data, address, clock, and control signals to the memorystrata 306-312 from the full hybrid memory buffer, as well as data fromthe memory strata 306-312 to the full hybrid memory buffer.

Full hybrid memory buffer 300 may fully control power delivery to eachof the memory strata 306-312, due, in part, to the size of the fullhybrid memory buffer 300. For example, some of the silicon-to-substrate(S-to-S) electrical connections (ECs) 304 are power delivery lines. Insome embodiments the S-to-S ECs 304 comprise solder bumps, though theymay comprise other connection technology in other embodiments. Becauseeach and every line routed from the package substrate 302 through theS-to-S ECs 304 arrives at the full hybrid memory buffer 300, the memorybuffer may implement a power gating scheme to turn on and power to theentire device comprising the stack of strata, to individual memorystrata, or potentially even to individual tiles within a given memorystrata.

In other embodiments, the full hybrid memory buffer 300 may include anintegrated voltage regulator (VR) that can dynamically modify thevoltage supplied to the entire device or a portion thereof. The voltagedelivered through the package substrate 302 may originate from a powerdelivery subsystem located on the system board, which may includeseveral VRs that each deliver power to individual power planes that spanportions of the system board.

FIG. 3B illustrates a top view of an embodiment of a strata-footprintfull hybrid memory buffer included in a hybrid memory package.

The solid line grid shown in FIG. 3B comprises a set of memory buffertiles (318). The MB tile grid 318 is shown from this perspective toillustrate the placement of each MB tile in relationship to the bottommemory tile in a column of memory tiles. The MB tile grid 318 is atop-down look at full hybrid memory buffer 300, compartmentalized intothe respective MB tiles that full hybrid memory buffer 300 comprises.

The dashed line grid shown in FIG. 3B comprises a set of memory tiles ina first strata directly on top of the MB tile grid 318 (corresponding tomemory strata 306). The grid of memory tiles 320 is slightly offset fromthe MB tile grid 318 specifically to be able to illustrate the twoseparate grids on top of each other (generally the grids would bealigned per tile.

Also shown in FIG. 3B are the TSVs (322), which, as discussed above,provide a means of delivering power and data between the MB tile grid318 and the memory tile grid 320. Additional memory tile grids,corresponding to memory strata 308, 310, and 312 would normally bepresent in FIG. 3B, but are not shown for sake of clarity of the figure.

FIG. 4A illustrates a side view of an embodiment of a small-footprintpartial hybrid memory buffer included in a hybrid memory package.

The partial hybrid memory buffer (HMB) 400 is located in a depressioncarved out from within package substrate 402. The depression may bereferred to as a HMB socket 404. In many embodiments, the stack ofmemory strata (i.e., memory strata 406, 408, 410, and 412) is locateddirectly above HMB 400, though HMB 400 does not span the entire widthand length of the grid of memory tile columns in the stack. Rather, HMB400 resides in the center of the grid of memory tile columns thatcomprise the memory strata stack. In these embodiments, the HMB 400 maybe coupled to the TSVs (e.g., TSVs 414 and 416) through redistributionlayer (RDL) lines or another type of coupling mechanism.

The HMB 400 has the potential to be denser and lower cost than thestrata-sized memory buffer shown in FIGS. 3A and 3B because there are nowidth and length size requirements for the HMB 400 chip package.Additionally, because the HMB 400 chip package does not cover the entirewidth and length of a memory strata, the memory strata stack may receivepower directly from the package substrate 402.

In some embodiments, the partial HMB 400 may include an integrated VRthat can dynamically modify the voltage supplied to the entire memorystack or a portion thereof. The voltage delivered through the packagesubstrate 402 may originate from a power delivery subsystem located onthe system board, which may include several VRs that each deliver powerto individual power planes that span portions of the system board.

FIG. 4B illustrates an exploded side view of an embodiment of ahybrid-sized memory buffer included in a hybrid memory package.

FIG. 4B includes the same components as FIG. 4A. The purpose of FIG. 4Bis to show specific couplings between the different components in anexploded view. In many embodiments, there are RDL lines 418 that couplethe HMB 400 to the TSVs (e.g., TSVs 414 and 416). The RDL lines 418 maybe routed throughout the underside of the memory stack to couple eachdata, address, clock, and control pin originating at the top of the HMB400 to their respective TSV. In other embodiments, wire bonds areutilized for the coupling mechanism rather than RDL lines.

In many embodiments, additional RDL lines create an HMB-substratecoupling 420. The HMB-substrate coupling 420 is just an illustrativeexample of one of the potentially many couplings that transferinformation and power from the package substrate 402 to the HMB 400. Inmany embodiments, the HMB 400 sends and receives information across theHS link (122 in FIG. 1) in the form of packets.

Inbound packets arrive at the HMB 400 through the HMB-substrate coupling420 and outbound packets are sent from the HMB 400 to other componentsin the computer system through the HMB-substrate coupling 420. CertainRDL lines that make up the HMB-substrate coupling 420 also deliver powerto the HMB 400 from the package substrate 402.

In another embodiment that is not shown, the HMB 400 may be coupled tothe package substrate through a ball grid array of coupling points onthe bottom of the HMB 400. In this embodiment, the HMB socket 404includes the coupling balls of the array. Though, this particularembodiment may require non-standard electrical routing in the packagesubstrate 402 since the substrate is thinner between the base of the HMBsocket 404 and the bottom of the substrate.

As mentioned above in reference to FIG. 4A, using a HMB 400 allowsdirectly coupling the memory strata stack to the package substratethrough memory strata-substrate coupling 422. This coupling allowsdirect power delivery from the package substrate to the memory stratastack instead of relying on power delivery that is routed through thebuffer (as is the case in the strata-sized buffer in FIGS. 3A and 3B).The power delivery memory strata-substrate coupling 422 directly couplesmemory strata 406, the bottom strata in the stack, to the substrate.Power is then delivered up through all of the memory strata in the stackby way of TSVs 414 and 416. Again, the memory strata-substrate coupling422 in FIG. 4B is an example illustration of a single coupling, thoughin practice there may be many such couplings throughout the BGA on thesubstrate with the memory strata stack.

FIG. 4C illustrates a top view of an embodiment of a partial hybridmemory buffer included in a hybrid memory package.

The HMB 400 shown in FIG. 4C is centrally located below the memorystrata stack to minimize the required length of the RDL lines 418. Thebottom memory strata in the memory strata stack is illustrated by thedashed line memory tile grid 424. The memory tile grid 424 shownincludes a 4×4 grid of memory tiles 426.

The HMB 400 is coupled to each memory tile in the grid through the RDLlines 418. These wire bonds 418 are coupled to the HMB-coupled TSVs 426.Additionally, each memory tile in the grid also includes one or moresubstrate-coupled TSVs 428. In many embodiments, the HMB-coupled TSVs426 deliver information (i.e., data, address, clock, and controlsignals) to the memory strata stack. Additionally, in many embodiments,the substrate-coupled TSVs 428 deliver power to the memory strata stack.

FIG. 5 illustrates a side view of an alternative embodiment of a hybridmemory package.

The HMB 500 in FIG. 5 is coupled to the package substrate 502 to theside of the memory strata stack including memory strata 504, 506, 508,and 510. Each memory strata in the memory strata stack has a set ofsolder bumps 512. RDL lines 514 on the top of each memory strata routeare routed to the edge of the strata, where wire bonds 516 are used tocouple to the RDL lines to the package substrate 502.

Both power and information (i.e., data, address, clock, and controlsignals) are transferred between the RDL and the substrate using thewire bonds 516. In the embodiments shown, TSVs are not required in thememory strata stack since the delivery of power and information arehandled by the wire bonds 516. In other embodiments that are not shown,TSVs may be utilized in the memory strata stack instead of RDL lines andwire bonds.

The information delivery lines are routed from the wire bond couplingsat the package substrate 502 to the HMB 500. In many embodiments, thewire bond coupling locations at the package substrate 502 are coupled tothe HMB 500 through package substrate traces. Benefits of the memorydevice package in FIG. 5 include a more straightforward packagesubstrate 502, without the need of a HMB socket and a lack of TSVs whichpossibly allow the memory tiles within each memory strata to be moreefficiently designed, since several TSVs take up otherwise unnecessaryreal estate among the circuitry within the memory tiles. Detriments forthe memory device package in FIG. 5 may include introducing more complexor lengthy timing requirements between the HMB 500 and the memory stratastack since the HMB 500 is significantly separated from the stack.

In some embodiments, the HMB 500 may include an integrated VR that candynamically modify the voltage supplied to the entire memory stack or aportion thereof. The voltage delivered through the package substrate 502may originate from a power delivery subsystem located on the systemboard, which may include several VRs that each deliver power toindividual power planes that span portions of the system board.

Returning to FIG. 2, each memory tile column, such as memory tile column210 requires an addressing scheme that allows access to specific storagelocations within a specific tile. Thus, address schemes utilized by thememory buffer 206 to address a given storage location in the memorycolumn will take into account which tile in the column is beingaddressed. For example, in FIG. 2, there are 8 tiles in each memory tilecolumn, 3 bits of the address can differentiate between the tile Z0through tile Z7 in the column.

For stacked configurations, each of the strata would be independentlyaddressed. In some embodiments, point-to-point connections between thememory buffer 206—and each memory strata are utilized. However,point-to-point connections will result in significant area overhead duelarge number of additional TSVs required to implement a fullpoint-to-point implementation. Another process that may be utilized toindependently address each memory tile in the column would be toindependently hard code a unique selection word for each stratum using aunique RDL design or top level metal design for each layer of the stack.Though, hard coding results in significant cost and manufacturingoverhead.

An alternative to these solutions would be to implement a scan chainprocess during initialization of the computer system to enableindependent addressing at each stratum.

FIG. 6 describes an embodiment of scan chain logic implemented in eachmemory stratum or memory tile to enable independent addressingdynamically during initialization.

The scan chain logic 600 in FIG. 6 represents an embodiment of the logicincluded in each memory strata 602 layer and potentially in each memorytile. The logic utilizes a TSV stacking technology in which the throughsilicon via is processed independently of the metal stack. The scan datainput is accessed on one side of the stratum layer while the scan dataoutput is accessed on the other side of the layer. However, both thescan data input and output are physically aligned such that whenmultiple strata are stacked, the input to one stratum is coupled to theoutput of another stratum. The scan chain is initialized such that eachstratum is programmed with a unique address code which is then used as acomparison reference to the incoming address selection. The dynamicaddress selection is compared with the static address selection toproduce a gating signal for a common strobe signal.

Specifically, a scan data input value 604 enters a chain of flip flops(e.g., FF 606, 608, 610, and 612). The chain of flip flops is fed by thescan chain clock 614. Based on the value of the input 604, the chain offlip flops is programmed with a unique value that corresponds to aunique stratum in the stack. The output from the chain of flip flops isfed into comparator 614, which compares the unique value of bits tocertain bits in the page address select lines 616.

The page address select lines 616 are sent through the entire stratastack using TSVs. The particular bits in the page address select linesthat are related to the determination of the specific strata the addressis referring to are also input into the comparator 614. If these twoaddresses match, then the comparator 614 output is driven high,otherwise the output value remains low. The comparator 614 output valueis fed into AND logic 618.

The other input into AND logic 618 is the page address strobe 620. Thus,if two addresses fed into the comparator 614 match, then the pageaddress strobe 620, fed through the memory strata stack using TSVs, maybe utilized at the local strata (strobe 622). If the addresses don'tmatch, then the page address strobe 620 is gated and not capable ofbeing utilized by the local strata 602.

Furthermore, the chain of flip flops may continue with further flipflops 624, 626, 628, and 630. These flip flops also are able to beprogrammed with a unique address utilizing the scan chain clock 614 andthe output from the last flip flop 612 in the previous flip flop chain.In many embodiments, these particular flip flops store a unique bank I/Oaddress that corresponds to certain bits in the bank I/O select lines632.

The outputs from the chain of flip flops 624-630 are fed into comparator634, which compares the unique value of bits to certain bits in the bankI/O select lines 632. The bank I/O select lines 632 are sent through theentire strata stack using TSVs. The particular bits in the bank I/Oselect lines 632 that are related to the determination of the specificstrata the address is referring to are also input into the comparator634. If these two addresses match, then the comparator 634 output isdriven high, otherwise the output value remains low. The comparator 634output value is fed into AND logic 636.

The other input into AND logic 636 is the bank I/O strobe 638. Thus, iftwo addresses fed into the comparator 634 match, then the bank I/Ostrobe 638, fed through the memory strata stack using TSVs may beutilized at the local strata (strobe 640). If the addresses don't match,then the page address strobe 640 is gated and not capable of beingutilized by the local strata 602.

The output of the last flip flop 630 in the chain is also fed into ascan data output value 642, which is utilized as the scan data input ofthe next memory strata in the stack. Thus, through programming of thisscan chain logic within each strata layer, a unique address can beassigned to each strata, which can be used to gate or not gate the pageaddress strobe and bank I/O strobe supplied to the entire stack. Thisallows only the strata pointed to by the address to be able to utilizethe strobe, and therefore perform memory read and write operations.

In many embodiments, this scan chain logic is programmed by the memorybuffer during initialization of the computer system. This dynamicprogramming at each initialization allows uniform memory tiles to beimplemented without any hard coding necessary to program in the memorystrata address per tile.

FIG. 7 is a block diagram of an embodiment of a memory tile in a hybridmemory device.

Memory tile A 700 is shown as a tile in the bottom strata of a stack ofmemory strata since the memory buffer 702 is adjacent to memory tile A.The vertical column of tiles in the stack of strata continues withmemory tile B 704 and so on. These tiles are all coupled to the memorybuffer 702 through the use of TSVs, such as clock and control TSVs 706and data and address TSVs 708.

An actual implementation of these TSVs would require many individualTSVs to transport at least the data and address information, but asingle TSV line is shown specifically to maintain the clarity of thefigure. Furthermore, the routing of the clock and control lines are notspecifically shown within memory tile A 700 other than to show that theclk signal and ctrl signals are provided to the memory tile from the TSVtraces. This is specifically to simplify the block diagram to alsomaintain clarity.

As was previously discussed, each memory tile in each strata in thestack may include one memory array or multiple memory arrays. In theembodiment illustrated in FIG. 7, memory tile A 700 includes twoseparate memory arrays, memory arrays 710 and 712.

In many embodiments, an address is supplied by memory buffer 702 on theaddress lines that make up the address TSVs. The address is received byaddress logic 714. Address logic 714 determines whether the address fromthe memory buffer 702 is referencing a memory location in one of thelocal memory arrays within memory tile A 700. In many embodiments, thisentails utilizing the scan chain tile logic 600 that was set up duringinitialization of the memory. An implementation of the scan chain tilelogic 600 has been discussed above with reference to FIG. 6.

If the address matches a local address location, address logic 714supplies the row and column decoders for each memory array: row decoder716 and column decoder 718 for memory array 710 and row decoder 720 andcolumn decoder 722 for memory array 712. The address location in thecorrect memory array is accessed through these decoders and then data isread from the location in the memory array or written to the location inthe memory array.

For example, when data is read from the location in one of the memoryarrays, the sense amps (724 and 726 for memory arrays 710 and 712,respectively) are used to sense the voltage level at each bit locationso the data can be pulled out and latched in the data latches (728 and730 for memory arrays 710 and 712, respectively). The data can then bepopulated onto the TSV data lines and read into the memory buffer 702.

FIG. 8 is a block diagram of an embodiment of the memory buffer in ahybrid memory device.

The memory buffer 800 receives a voltage supply 802 from a packagesubstrate, which may receive voltage from a power delivery planeintegrated into the system board in the computer system. In manyembodiments, the voltage supply powers the circuitry throughout thememory buffer 800. The memory buffer 800 includes a high speed I/Ointerface 804 that sends and receives packetized data across a highspeed link (such as link 122 in FIG. 1). The high speed link may includeHS data input 806 received from the link and HS data output 808 sent tothe link.

As described above, the link may comprise a PCI-Express interface, afully-buffered dual-inline-memory-module (DIMM) interface, a scalablememory interface (SMI), a proprietary point-to-point interface, such asthe QuickPath technology by Intel®, or another such high speedinterface. In many embodiments, the link has multiple lanes, where eachlane is a high speed bi-directional serial interface. In manyembodiments, there are many lanes that comprise the entire link (forexample, 32 lanes, 128 lanes, 512 lanes, etc.).

In many embodiments, the memory is implemented on a transactional basis.Thus, a memory read request may be sent from the CPU (104 in FIG. 1)without regard to when the request will be completed. These transactionsmay be packetized and sent across the high speed link. In manyembodiments, the transactions may be optimized through a reorderingprocess.

For example, three transactions are received in a certain order from theHS link. These three transactions are input into the transaction inputfirst-in-first-out (FIFO) buffer 810. If the first and thirdtransactions received are requesting data from the same page of memory,but the second transaction utilizes a different page, transactionordering logic 812 may realize that by flipping the order of the secondand third transactions less memory pages would be required to be closedand opened. This works well in a transactional memory system where eachtransaction is viewed atomically without regard other transactions.

Once transactions are received and potentially reordered within thetransaction input FIFO buffer 810, the transactions are then processedby packetization/depacketization (P/D) logic 814. P/D logic 814 takesthe specific memory transactions out of the packets and transitions themto a basic address/data format utilized by the memory tiles in thestrata, such as memory strata A 816. In other embodiments that are notshown, the P/D logic 814 is located on the HS I/O interface 814 side ofthe transaction input FIFO 810. In these embodiments, the transactionordering logic 812 is more generally considered a memory accessreordering logic because specific depacketized memory transactions arereordered, rather than packets.

When the D/P logic 814 depacketizes a memory transaction received fromthe HS link, the address and data are provided to the memory stackthrough TSVs. Specifically, address TSVs 818 as well as data TSVs 820.In many embodiments, the data lines are combined and are able to performwrite operations by feeding data from the memory buffer 800 to a memorylocation in the memory strata stack as well as perform a read operationby feeding data from a memory location in the memory strata stack to thememory buffer 800.

Additionally, the memory buffer 800 also may generate several controlsignals 822 from one or more of the functional blocks shown in thebuffer. These control signals are output to the memory strata stackthrough control TSVs 824. Memory buffer 800 also includes clockgeneration logic 826 to generate a clock signal provided to memorystrata stack through clock TSV 828.

The memory buffer 800 may also include scan chain initialization logic830 to provide the scan data 832 and scan clock 834 utilized by the scanchain tile logic described in FIG. 6. The scan chain initializationlogic 830 may perform the scan chain initialization when the computersystem boots.

In many embodiments, the memory buffer 800 includes several componentsthat enable dynamic workarounds for errors that show up in the memorydevice. At the smallest granularity, an error comprises an incorrectresult when reading a memory location. These errors may be hardwareerrors that involve failed components in the memory tiles (e.g., anelectrical failure of a sense amp) or soft errors that result fromcosmic rays causing a temporary malfunction of hardware. Hard errors aregenerally permanent errors that exhibit repeatable results when tested,whereas soft errors are generally one time only errors.

In many embodiments, failures of hardware components in the memory maybe due in part to a modification in the delivery of power to the memorydevice. For example, in a low power state, the voltage fed to the memorystrata may not be sufficient to maintain a charge in each memory cell.If a charge cannot be maintained, failure of the memory will occur.Alternatively, if the refresh rate of memory is decreased in frequencypast the point where the charge in a given memory cell sufficientlydiminishes, failure of the memory will also occur. The refresh rate ofmemory and the power supplied to memory are related. The greater amountof power supplied to memory, the less frequent the memory cells requireto be refreshed because the charge takes longer to dissipate.Conversely, the lesser amount of power supplied to the memory, thegreater the frequency the memory cells require to be refreshed.

In many embodiments, the memory buffer 800 includes dynamic errorworkaround logic 836, which provides several capabilities to minimizethe impact of errors that appear in the memory. Error checking andcorrection (ECC) logic 838 provides code to check for errors as theyappear in memory and attempts to correct the errors. In someembodiments, some errors may allow for this form of correction. Forexample, the memory buffer 800 may incorporate a type of BCH (Bose,Ray-Chaudhuri, and Hocquenghem) error correcting code, which potentiallyhas the ability to correct a single bit errors and detect double biterrors within a 128-bit block boundary. Though, in many embodimentswhere hard errors are present (e.g., a certain column in a memory tileis presenting incorrect data), a number of more robust workarounds maybe utilized.

In some embodiments, redundancy control logic 840 may permanently shutdown portions of a memory array. For example, if several bits in aspecific memory column are repeatedly coming up with bad test results,the redundancy control may permanently shut down that particular column.Specifically, a row of memory may only require 32 bits, but the actualmemory array may implement 33 bits. Thus, redundancy logic may lookacross all columns and determine which one exhibits the largest numberof repeating errors. This determined column may be permanently disabledand the other 32 bit-wide columns may be utilized for the memory rows.

Redundancy logic includes multiplexer (MUX) logic 842 which keeps trackof which columns or rows may be shut down on a per array basis. Theredundancy control 840, during initialization, may lock out the unusedcolumns and rows per array. In other embodiments, the MUX logic 842 maystore information about memory cells at a finer or coarser granularitythan a per array basis.

Apart from redundancy control logic 840, the dynamic error workaroundlogic may also implement cache line disable logic 844, whichincorporates the ability to disable memory pages or rows. To utilize thecache line disable logic 844, the memory buffer would additionallyimplement a tag cache 846. The tag cache 846 would specifically beuseful to enable a hardware-controller first level memory or last levelcache. For example, when a two level memory system is implemented in acomputer system, the first level memory is optimized for powerefficiency and bandwidth but may have moderate capacity due to costconstraints. The second level memory may be optimized for cost andcapacity but not necessarily for bandwidth and power efficiency.

The separate levels of memory in a two level memory scheme generally arenot visible to the CPU. This provides modularity and compatibility andalso enables a unified memory interface that can talk to far memory,near memory or 2 level memory.

FIG. 9 illustrates an embodiment of a two-level memory system utilizinga hybrid stacked memory.

The two-level memory system in FIG. 9 includes a processor with a memorycontroller 900. The processor/memory controller 900 send and receivedata with a memory subsystem 902. The memory subsystem includes a hybridmemory buffer 800 that has a tag cache 846. The hybrid memory buffer 800is coupled to a memory strata stack 904 and a far memory 906. In manyembodiments, the memory tiles that comprise the hybrid memory stack areDRAM-based devices. In different embodiments, the far memory may be anon-volatile memory, a phase change memory, or another type of memorytechnology.

In many embodiments, the data is transferred between theprocessor/memory controller 900 and the hybrid memory buffer in 64 Bytechunks, which is the same size of the data chunks that pass between thehybrid memory buffer and the hybrid memory stack 904. In manyembodiments, 64 Byte blocks are the smallest granularity that data isstored in the hybrid memory stack, whereas with far memory the data maybe stored in 4 Kilobyte blocks, which causes 4 Kbyte chunks of data tobe transferred between the hybrid memory buffer 800 and the far memory906.

The tag cache 846 may store an address tag for each far memory block(which are 4 Kbytes in size in this example). Each tag would also beaccompanied by a valid bit, a dirty bit, a pseudo LRU tag and a cacheline disable bit. Following a tag hit, hybrid memory buffer 800 fetchesa 64 Byte block from the hybrid memory stack 904 (first level memory).In response to a tag miss, a 4 KByte block would be fetched from the farmemory 906 (second level) and stored in the hybrid memory stack 904.

Additionally, the desired 64 Byte block would be forwarded to theprocessor/memory controller 900 and the appropriate tag way would bereplaced. The replacement policy would prioritize invalid ways in thehybrid memory stack 904 and may be based on a standard pseudo leastrecently used (LRU) approach. Ways that had the cache line disable bitasserted would be avoided. Thus, cache lines that exhibit hard errorsmay be disabled from further use in this way in a two-level memorysystem.

Returning to FIG. 8, the cache line disable logic 844 may use the tagcache 846 in the above described way to implement the cache line disablepolicy.

In many embodiments, the power delivery to the hybrid memory stack maybe adaptable, which allows changing the voltage level supplied to thememory based on the error rate of the memory. Hybrid memory buffer 800includes adaptive power logic 848. Adaptive power logic 848 maycommunicate with an integrated VR 850 to chain the supply voltage 802that is supplied to the strata on the stack (852). In many embodiments,the adaptive power logic 848 may increment voltage on a step by stepbasis or decrement voltage the same way where each step is a certaindelta voltage value. In other embodiments that are not shown, the VR isnot integrated into the hybrid memory buffer 800 but rather is adiscrete VR on the package substrate (118 in FIG. 1) or elsewhere in thecomputer system.

In some embodiments, voltage may be separately supplied to each memorytile in the hybrid memory device (such as memory tile 202 in FIG. 2). Inother embodiments, voltage may be supplied to each memory strata (suchas memory strata 204 in FIG. 2). In yet other embodiments, voltage maybe uniformly supplied to the entire memory device, which includes theentire stack of memory strata (such as memory device 200 in FIG. 2).

The hybrid memory buffer 800 may also include adaptive refresh logic854, which may be operable to change the refresh rate to the memory. Theadaptive refresh logic 854 may be capable of increasing or decreasingthe refresh rate of memory in steps, where each step is a delta of time.In different embodiments, the modification in refresh rate may beimplemented on a memory tile basis, a memory strata basis, or an entirememory device basis, similarly to the different granularity embodimentsdescribed above for the adaptive power logic 848.

In many embodiments, built-in self test (BIST) logic implementing alinear feedback shift register (LFSR) 856 is present in the hybridmemory buffer. The BIST-LFSR logic 856 allows random patterns of data tobe written across all of memory in the entire stack and read back forcomparison. The BIST-LFSR logic has a seed value input that generates acontinuously random pattern of data, each chunk of data can be writteninto each cache line in the memory stack. Then when reading the memoryback to check for integrity, the same seed value may be input again togenerate the same data.

Thus, the data, although random, is repeatable with the same seed value.Therefore, the random pattern created the second time may be compared,cache line by cache line, to the original data placed in memory. Thisallows for quick error checking across memory. If different seeds areplaced and the entire memory is checked several times, those bits withinmemory that consistently show errors may be designated as having harderrors which are repeatable. The dynamic error workaround logic 836 maytry one or more of several workarounds available to minimize errors.

Some of the options the dynamic error workaround logic 836 has tominimize the impact of problematic memory cells include logic componentsthat have been discussed above, such as ECC 838, redundancy controllogic 840, cache line disable logic 844, as well as potentiallyincreasing power delivered to the cells through adaptive power logic 848and/or decreasing the time between memory refreshes with adaptiverefresh logic 854.

FIG. 10 is a flow diagram of an embodiment of a process utilizingadaptive power logic to optimize the power delivered to the hybridmemory device.

The process may be performed by processing logic that may comprisehardware (e.g., circuitry), software (e.g., an operating system),firmware (e.g., microcode), or a combination of any of the three typesof processing logic listed.

The process begins by processing logic setting an initial power supplylevel (processing block 1000). In some embodiments, the initial powersupply level may be a highest power level capable of being supplied. Inother embodiments, the initial power supply level may be a standardsupply level in the center of the recommended supply settings. In yetother embodiments, the initial power supply level may be set by a userin a basic input/output system (BIOS) setting for initialization.

Processing logic then decreases the power supply level from the currentsetting by a step or increment (processing block 1002). The delta inpower supplied per increment may be predetermined based on the VR logicsince many VRs have a table of voltage supply levels that can be steppedthrough using a different value input into a register or other storagelocation managed by the VR.

Once the power supply level has decreased by the increment, processinglogic then performs tests on memory by writing to memory locations(processing block 1004). Processing logic may utilize a BIST-LFSR oranother type of testing process. The memory locations tested may includeall of memory in some embodiments. Though in other embodiments, dynamicerror workaround logic (836 in FIG. 8) may have already determined agroup of potentially faulty memory locations and a subset of all memorymay be tested to determine workarounds for errors in the faultylocations only.

Then processing logic reads each memory location that has been tested(processing block 1006). Processing logic then determines whether anerror has been detected (processing block 1008). In many embodiments,ECC or other similar error detection code is utilized to determine ifone or more errors are present. If no errors are present, processinglogic returns to block 1002 and further decreases the power supplylevel. Otherwise, if an error has been detected, processing logicattempts to correct the error or potentially avert the error (processingblock 1010).

The set of steps utilized to correct or avert the error areimplementation-specific, although the techniques may include: ECC forerror correction, redundancy control and cache line disabling for erroraversion, as well as potentially decreasing the time between memoryrefreshes. Furthermore, another option is to increase the power back upto the previous voltage level increment if the previous voltage levelproduced no error.

Processing logic then checks to see if the error was successfullycorrected or averted (processing block 1012). If the error wassuccessfully corrected or averted, processing logic may return to block1002 to further decrease the power supply level.

In other embodiments that are not shown, the initial power supplied maybe a low power level and the increments increase the power suppliedrather than decrease the power supplied. In these embodiments, theinitial test increments may exhibit a significant number of errors andthe supply is increased until the errors dissipate.

In some embodiments, the adaptive power logic (848 in FIG. 8) performsthese increment tests during initialization. In other embodiments, thesetests are performed dynamically during operation to modify the powersupplied to the memory stack. High bandwidth transfers between thehybrid memory stack and the hybrid memory buffer require higher power ingeneral than during a refresh, thus power supplied to the memory may bedynamically lowered one or more increments during the refresh phase.

Once the refresh phase is complete and bandwidth is once againincreased, the adaptive power logic 848 may increase the power one ormore increments.

FIG. 11 is a flow diagram of an embodiment of a process utilizingadaptive refresh logic to optimize the power delivered to the hybridmemory device. Each time memory is refreshed, a certain amount of poweris required to accomplish the refresh. Thus, if the refresh interval isincreased, the overall power over time required by the memory isdecreased.

The process may be performed by processing logic that may comprisehardware (e.g., circuitry), software (e.g., an operating system),firmware (e.g., microcode), or a combination of any of the three typesof processing logic listed.

The process begins by processing logic setting an initial memory refreshrate (processing block 1100). In some embodiments, the initial refreshrate may be predetermined by a BIOS setting during initialization.

Processing logic then increases the memory refresh interval from thecurrent setting by a step or increment (processing block 1102). Thedelta in time between refresh intervals may be a predetermined value ora value set by a user in the BIOS.

Once the refresh rate has increased by the increment, processing logicthen performs tests on memory by writing to memory locations (processingblock 1104).

Then processing logic reads each memory location that has been tested(processing block 1106). Processing logic then determines whether anerror has been detected (processing block 1108). In many embodiments,ECC or other similar error detection code is utilized to determine ifone or more errors are present. If no errors are present, processinglogic returns to block 1002 and further increases the interval betweenrefreshes. Otherwise, if an error has been detected, processing logicattempts to correct the error or potentially avert the error (processingblock 1110).

Again, the set of steps utilized to correct or avert the error areimplementation-specific, but may include ECC, redundancy control, cacheline disabling decreasing the refresh rate interval or increasing thepower supplied to the memory.

Processing logic then checks to see if the error was successfullycorrected or averted (processing block 1112). If the error wassuccessfully corrected or averted, processing logic may return to block1102 to further increase the refresh rate interval.

Returning to FIG. 8, hybrid memory buffer 800 also may include a virtualpage buffer 858. In many embodiments, the virtual page buffer 858 maystore at least a portion of each currently opened page in the memory. Itis common for memory access patterns to exhibit temporal and spatiallocality. In the past, this locality was exploited by keeping the memorypage open at each bank to reduce the latency and power of reopening anecessary page. However, given the multi-threaded operation of CPUstoday, severe bank conflict may result. Given this problem, the virtualpage buffer 959 may store a portion of each opened page in the hybridmemory buffer to reduce the chances of bank conflicts and so that thepage may be accessed by a memory request. The hybrid memory buffer 800enables this virtual open-page to both reduce power and latency and toincrease bandwidth of the device.

Elements of embodiments of the present invention may also be provided asa machine-readable medium for storing the machine-executableinstructions. The machine-readable medium may include, but is notlimited to, flash memory, optical disks, compact disks-read only memory(CD-ROM), digital versatile/video disks (DVD) ROM, random access memory(RAM), erasable programmable read-only memory (EPROM), electricallyerasable programmable read-only memory (EEPROM), magnetic or opticalcards, propagation media or other type of machine-readable mediasuitable for storing electronic instructions. For example, embodimentsof the invention may be downloaded as a computer program which may betransferred from a remote computer (e.g., a server) to a requestingcomputer (e.g., a client) by way of data signals embodied in a carrierwave or other propagation medium via a communication link (e.g., a modemor network connection).

In the description above, certain terminology is used to describeembodiments of the invention. For example, the term “logic” isrepresentative of hardware, firmware, software (or any combinationthereof) to perform one or more functions. For instance, examples of“hardware” include, but are not limited to, an integrated circuit, afinite state machine, or even combinatorial logic. The integratedcircuit may take the form of a processor such as a microprocessor, anapplication specific integrated circuit, a digital signal processor, amicro-controller, or the like.

It should be appreciated that reference throughout this specification to“one embodiment” or “an embodiment” means that a particular feature,structure or characteristic described in connection with the embodimentis included in at least one embodiment of the present invention.Therefore, it is emphasized and should be appreciated that two or morereferences to “an embodiment” or “one embodiment” or “an alternativeembodiment” in various portions of this specification are notnecessarily all referring to the same embodiment. Furthermore, theparticular features, structures or characteristics may be combined assuitable in one or more embodiments of the invention.

Similarly, it should be appreciated that in the foregoing description ofembodiments of the invention, various features are sometimes groupedtogether in a single embodiment, figure, or description thereof for thepurpose of streamlining the disclosure aiding in the understanding ofone or more of the various inventive aspects. This method of disclosure,however, is not to be interpreted as reflecting an intention that theclaimed subject matter requires more features than are expressly recitedin each claim. Rather, as the following claims reflect, inventiveaspects lie in less than all features of a single foregoing disclosedembodiment. Thus, the claims following the detailed description arehereby expressly incorporated into this detailed description.

1. A memory device comprising: a package substrate having a first side;a hybrid memory buffer chip attached to the first side of the packagesubstrate, the hybrid memory buffer including high speed input/output(HSIO) logic to support a HSIO interface with a processor and packetprocessing logic to support a packet processing protocol on the HSIOinterface; and one or more memory tiles vertically stacked on the hybridmemory buffer, each memory tile including a memory array and tileinput/output (IO) logic.
 2. The memory device of claim 1, wherein thehybrid memory buffer further includes transaction logic to supporttransactional memory operations.
 3. The memory device of claim 1,wherein the one or more memory tiles comprises two or more memory tiles.4. The memory device of claim 3, further comprising an integrated powersupply attached to the package substrate, the integrated power supplyhaving a plurality of outputs to provide separate power supplies to atleast some of the two or more memory tiles.
 5. The memory device ofclaim 4, wherein the hybrid memory buffer chip further includes powersupply control logic to individually control power provided to at leasttwo of the two or more memory tiles.
 6. The memory device of claim 3,wherein the hybrid memory buffer chip further includes an integratedpower supply having a plurality of outputs to provide separate powersupplies to at least some of the one or more memory tiles.
 7. The memorydevice of claim 6, wherein the hybrid memory buffer chip furtherincludes power supply control logic to individually control powerprovided to at least two of the two or more memory tiles.
 8. The memorydevice of claim 1, wherein the hybrid memory buffer is electricallycoupled with each of the one or more memory tiles through one or morethru silicon vias.
 9. The memory device of claim 1, wherein hybridmemory buffer is a partial hybrid memory buffer.
 10. The memory deviceof claim 9, wherein the package substrate includes a cavity capable ofreceiving the partial hybrid memory buffer and the partial memory bufferis positioned within the cavity.
 11. The memory device of claim 10,wherein the two or more memory tiles includes a base memory tileproximate to the partial hybrid memory buffer, the base memory tileincluding a first side facing the partial hybrid memory buffer, whereinan interconnect redistribution layer (RDL) is deposited on the firstside of the base memory tile.
 12. The memory device of claim 10, whereinthe hybrid memory buffer chip is electrically coupled with the basememory tile through the RDL.
 13. The memory device of claim 10, whereinthe hybrid memory buffer chip is electrically coupled to the packagesubstrate.
 14. The memory device of claim 1, wherein each memory tile isindividually addressable based, at least in part, on a code programmedinto scan chain logic associated with the memory tile.
 15. The memorydevice of claim 1, wherein the hybrid memory buffer chip includesredundancy logic to provide redundancy capabilities for at least some ofthe one or more memory tiles.
 16. The memory device of claim 15, whereinthe redundancy logic includes an error correction code.
 17. The memorydevice of claim 16, wherein the error correction code comprises a BCH(Bose, Ray-Chaudhuri) code.
 18. The memory device of claim 1, whereinthe memory device provides a first level of memory in a computing systemhaving two or more levels of memory, the system to include a secondlevel of memory external to the memory device, the second level ofmemory having a plurality of memory blocks.
 19. The memory device ofclaim 18, wherein the hybrid memory buffer chip includes a tag cache tostore an address tag for at least a subset of the plurality of memoryblocks.
 20. The memory device of claim 18, wherein each address tagincludes a disable bit to disable a page of memory.
 21. The memorydevice of claim 18, wherein the redundancy logic includes logic todetermine an error rate for a page of memory and logic to set thedisable bit corresponding to the page of memory if its error rateexceeds a threshold.
 22. A memory device comprising: a package substratehaving a first side; a hybrid memory buffer chip attached to the packagesubstrate, the hybrid memory buffer including high speed input/output(HSIO) logic to support a HSIO interface with a processor and packetprocessing logic to support a packet processing protocol on the HSIOinterface; and one or more memory tiles vertically stacked on thepackage substrate, each memory tile including a memory array and tileinput/output (IO) logic.
 23. The memory device of claim 22, wherein thehybrid memory buffer further includes transaction logic to supporttransactional memory operations.
 24. The memory device of claim 22,wherein an interconnect redistribution layer (RDL) is deposited on aside of at least one of the one or more memory tiles and the RDL iselectrically coupled with the hybrid memory buffer chip.
 25. The memorydevice of claim 22, wherein each memory tile is individually addressablebased, at least in part, on a code programmed into scan chain logicassociated with the memory tile.
 26. The memory device of claim 22,wherein the hybrid memory buffer chip includes redundancy logic toprovide a redundancy a redundancy capabilities for at least some of theone or more memory tiles.
 27. A system comprising: a processor; and amemory device coupled with the processor via a high speed interconnect,the memory device including a package substrate having a first side, ahybrid memory buffer chip attached to the first side of the packagesubstrate, the hybrid memory buffer including high speed input/output(HSIO) logic to support a HSIO interface with the processor and packetprocessing logic to support a packet processing protocol on the HSIOinterface, and one or more memory tiles vertically stacked on the hybridmemory buffer, each memory tile including a memory array and tileinput/output (IO) logic.
 28. The system of claim 27, wherein the memorydevice provides a first level of memory in a computing system having twoor more levels of memory.
 29. The system of claim 28, furthercomprising: a memory subsystem coupled with the memory device, thememory subsystem to provide a second level of memory, wherein the secondlevel of memory includes a plurality of memory blocks.
 30. The system ofclaim 29, wherein each address tag includes a disable bit to disable amemory block.
 31. The system of claim 30, wherein the hybrid memorybuffer chip includes logic to determine an error rate for a memory blockand logic to set the disable bit corresponding to the memory block ifits error rate exceeds a threshold.
 32. The system of claim 27, whereinthe hybrid memory buffer chip further includes transaction logic tosupport transactional memory operations.
 33. The system of claim 27,wherein hybrid memory buffer chip is a partial hybrid memory bufferchip.
 34. The system of claim 33, wherein the package substrate includesa cavity capable of receiving the partial hybrid memory buffer and thepartial memory buffer is positioned within the cavity.